AP-306
MAXTOR AP-306 THERMAL PUTTY 11.5W/mk 100G-PINK
Maxtor AP-306 Pink Thermal Putty 100g, 11.5W/m·K High-Conductivity Non-Curing Gap Filler, Electrically Insulating, Compressible Cooling Material for GPU VRAM, VRM, SSD, Laptop & Console
Maxtor AP-306 Pink Thermal Putty 100g, 11.5W/m·K High-Conductivity Non-Curing Gap Filler, Electrically Insulating, Compressible Cooling Material for GPU VRAM, VRM, SSD, Laptop & Console
Expert Features
- 11.5 W/m·K Thermal Conductivity: High-performance thermal putty helps transfer heat between electronic components and compatible cooling surfaces.
- 100g Pink Thermal Putty: Generous quantity of distinctly pink, moldable thermal-interface material for electronics servicing and custom gap-filling applications.
- Excellent Gap-Filling Performance: Soft putty conforms to uneven surfaces and varying component heights, helping eliminate insulating air gaps.
- GPU VRAM & VRM Cooling: Suitable for compatible graphics-card memory chips and voltage-regulation components that require a compressible gap-filling material.
- Non-Curing Formula: Remains soft and moldable instead of permanently hardening, supporting servicing and component rework.
- Electrically Non-Conductive: Insulating formulation helps minimize electrical short-circuit risks in densely populated electronic assemblies.
- High Compressibility: Adapts to irregular contact surfaces under suitable heatsink pressure, helping maintain effective thermal contact.
- Wide Operating Temperature Range: Manufacturer-rated operating range of −40°C to +200°C for electronic thermal-management applications.
- Long-Term Material Stability: Designed to resist drying and pump-out during service, helping maintain a stable thermal interface.
- Easy Application & Removal: Moldable consistency allows technicians to place and shape the required quantity without cutting rigid thermal pads.
- Gaming Console & Laptop Cooling: Suitable for appropriate thermal interfaces in consoles, laptops, and compact gaming electronics.
- SSD & Power Electronics Cooling: Designed for compatible SSD controllers, memory modules, power-supply components, LED drivers, and other electronic assemblies.
- Service-Friendly Design: Non-curing material supports maintenance and rework; contaminated or removed material should not automatically be reused.
Expert Specs
| Brand | Maxtor |
| Model | AP-306 / AP306 |
| Product Type | High-Performance Thermal Putty |
| Material | Polymer-Based Thermal Interface Putty |
| Color | Pink |
| Net Weight | 100g |
| Packaging | White Plastic Jar with Screw Lid |
| Thermal Conductivity | 11.5 W/m·K |
| Thermal Conductivity Test | ASTM D5470 |
| Density | 3.3 ± 0.08 g/mL |
| Density Test | ASTM D792 |
| Operating Temperature | −40°C to +200°C |
| Electrical Properties | Electrically Insulating |
| Breakdown Strength | Greater than 6.2 kV/mm |
| Breakdown Test | ASTM D149 |
| Vdaf (200°C, 24 Hours) | Less than 0.6% |
| Curing Behavior | Non-Curing |
| Material Consistency | Soft, Moldable, Compressible |
| Interface Type | Gap-Filling Thermal Interface |
| Surface Compatibility | Suitable Electronic Cooling Surfaces |
| Main Applications | GPU VRAM, VRM, Power Components |
| Additional Applications | Laptops, Gaming Consoles, SSDs, LED Modules, Electronic Assemblies |
| Application Method | Apply and Shape to Required Thermal Gap |
| Manufacturer-Listed Shelf Life | 5 Years |
| Manufacturer-Listed Compliance | RoHS / REACH |
Installation Note: Installation note: AP-306 is a compressible thermal gap filler for suitable interfaces such as VRAM and VRM. Do not automatically replace conventional thin-bond-line paste on a bare CPU or GPU die. Confirm the intended contact gap and heatsink pressure before application.
